Washington, March 28 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC) is engaged in discussions with the Trump administration’s potential tariffs on semiconductor imports to the United States, aiming to work out a solution that benefits both sides, a senior company executive said Friday.
Speaking at a forum hosted by the American think tank Hudson Institute, TSMC Senior Vice President Peter Cleveland emphasized that the company was maintaining close communication with the White House and expressed optimism that discussions would move in a “positive direction.”
According to Cleveland, talks were ongoing, particularly concerning Taiwan’s extensive semiconductor manufacturing ecosystem and its exports to the U.S.
“And they’re listening,” he noted.
However, he acknowledged that TSMC was still uncertain about what will happen on Wednesday, when U.S. President Donald Trump is expected to introduce a slew of new tariffs.
To avoid the tariffs and appease Trump, who is eager to shift manufacturing back to the United States, TSMC has already made substantial investments in the country. The company recently committed an additional US$100 billion to build three wafer fabrication plants, two advanced IC packaging facilities, and a research and development center, bringing its total investments in the U.S. state of Arizona to US$165 billion.
At the forum, titled “Building a Sustainable and Successful Semiconductor Ecosystem under the Trump Administration,” other industry leaders also weighed in on the potential impact of the proposed tariffs.
Jonathan Hoganson, head of U.S. government affairs at semiconductor equipment supplier ASML, stressed that industry players hope the new policy will strengthen the ecosystem rather than create barriers.
Patrick Wilson, vice president of government relations at smartphone IC designer MediaTek, underscored the importance of fostering a favorable business environment.
“We just want to have the right tariff or regulatory environment that makes it possible for our customers to win,” he said.
